Bottom Lateral Expansion of Contact Plugs Through Implantation

ABSTRACT

A method includes forming a metallic feature, forming an etch stop layer over the metallic feature, implanting the metallic feature with a dopant, forming a dielectric layer over the etch stop layer, performing a first etching process to etch the dielectric layer and the etch stop layer to form a first opening, performing a second etching process to etch the metallic feature and to form a second opening in the metallic feature, wherein the second opening is joined with the first opening, and filling the first opening and the second opening with a metallic material to form a contact plug.

BACKGROUND

In the manufacturing of integrated circuits, contact plugs are used forelectrically coupling to the source and drain regions and the gates oftransistors. The source/drain contact plugs were typically connected tosource/drain silicide regions, whose formation processes include formingcontact openings to expose source/drain regions, depositing a metallayer, depositing a barrier layer over the metal layer, performing ananneal process to react the metal layer with the source/drain regions,filling a metal such as tungsten or cobalt into the remaining contactopening, and performing a Chemical Mechanical Polish (CMP) process toremove excess metal. There may be more than one level of contact plugsformed.

Conventionally, when forming upper-level contact plugs, the bottomportions of upper-level contact plugs were expanded to solve problemssuch as the corrosions of the lower-level contact plugs. The bottomportions extend into the lower-level contact plugs. The lateralexpansion, however, was difficult to achieve since the lateral expansionwill cause the openings in which the upper-level contact plugs areformed to be deeper.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1-7, 8A, 8B, 9A, 9B, 10A, 10B, 11, 12A, 12B, and 13-17 areperspective views and cross-sectional views of intermediate stages inthe formation of a transistor and the respective contact plugs inaccordance with some embodiments.

FIGS. 18 and 19 are profiles of implanted species in a contact plug andan inter-level dielectric, respectively, in accordance with someembodiments.

FIG. 20 illustrates a top view of a contact plug in accordance with someembodiments.

FIG. 21 illustrates the plot of lateral recessing distances versesrecessing depths in accordance with some embodiments.

FIG. 22 illustrates a process flow for forming a Fin Field-EffectTransistor (FinFET) and corresponding contact plugs in accordance withsome embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “underlying,” “below,”“lower,” “overlying,” “upper” and the like, may be used herein for easeof description to describe one element or feature's relationship toanother element(s) or feature(s) as illustrated in the figures. Thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. The apparatus may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein may likewise be interpretedaccordingly.

A contact plug and the method of forming the same are provided inaccordance with some embodiments. An upper contact plug is formed over alower contact plug. An implantation process is performed to dope adopant into a top portion of the lower contact plug. A dielectric layeris formed over the lower contact plug, and a contact opening is formedin the dielectric layer. The lower contact plug is then recessed bothvertically and laterally. With the dopant in the top portion of thelower contact plug, the lateral recessing rate is increased relative tothe vertical recessing rate. Accordingly, the bottom portion of theupper contact plug is enlarged laterally much more than being enlargedvertically. Embodiments discussed herein are to provide examples toenable making or using the subject matter of this disclosure, and aperson having ordinary skill in the art will readily understandmodifications that can be made while remaining within contemplatedscopes of different embodiments. Throughout the various views andillustrative embodiments, like reference numbers are used to designatelike elements. Although method embodiments may be discussed as beingperformed in a particular order, other method embodiments may beperformed in any logical order.

FIGS. 1-7, 8A, 8B, 9A, 9B, 10A, 10B, 11, 12A, 12B, and 13-17 illustratethe cross-sectional views of intermediate stages in the formation of aFin Field-Effect Transistor (FinFET) and the corresponding contact plugsin accordance with some embodiments of the present disclosure. Thecorresponding processes are also reflected schematically in the processflow shown in FIG. 22.

FIG. 1 illustrates a perspective view of an initial structure formed onwafer 10. Wafer 10 includes substrate 20. Substrate 20 may be asemiconductor substrate, which may be a silicon substrate, a silicongermanium substrate, or a substrate formed of other semiconductormaterials. Substrate 20 may be doped with a p-type or an n-typeimpurity. Isolation regions 22 such as Shallow Trench Isolation (STI)regions may be formed to extend from a top surface of substrate 20 intosubstrate 20. The respective process is illustrated as process 202 inthe process flow 200 shown in FIG. 22. The portions of substrate 20between neighboring STI regions 22 are referred to as semiconductorstrips 24. The top surfaces of semiconductor strips 24 and the topsurfaces of STI regions 22 may be substantially level with each other.In accordance with some embodiments of the present disclosure,semiconductor strips 24 are parts of the original substrate 20, andhence the material of semiconductor strips 24 is the same as that ofsubstrate 20. In accordance with alternative embodiments of the presentdisclosure, semiconductor strips 24 are replacement strips formed byetching the portions of substrate 20 between STI regions 22 to formrecesses, and performing an epitaxy process to regrow anothersemiconductor material in the recesses. Accordingly, semiconductorstrips 24 are formed of a semiconductor material different from that ofsubstrate 20. In accordance with some embodiments, semiconductor strips24 are formed of silicon germanium, silicon carbon, or a III-V compoundsemiconductor material.

STI regions 22 may include a liner oxide (not shown), which may be athermal oxide formed through the thermal oxidation of a surface layer ofsubstrate 20. The liner oxide may also be a deposited silicon oxidelayer formed using, for example, Atomic Layer Deposition (ALD),High-Density Plasma Chemical Vapor Deposition (HDPCVD), Chemical VaporDeposition (CVD), or the like. STI regions 22 may also include adielectric material over the liner oxide, wherein the dielectricmaterial may be formed using Flowable Chemical Vapor Deposition (FCVD),spin-on coating, or the like.

Referring to FIG. 2, STI regions 22 are recessed, so that the topportions of semiconductor strips 24 protrude higher than the topsurfaces 22A of the remaining portions of STI regions 22 to formprotruding fins 24′. The respective process is illustrated as process204 in the process flow 200 shown in FIG. 22. The etching may beperformed using a dry etching process, wherein NF₃ and NH₃ are used asthe etching gases. During the etching process, plasma may be generated.Argon may also be included. In accordance with alternative embodimentsof the present disclosure, the recessing of STI regions 22 is performedusing a wet etching process. The etching chemical may include HF, forexample.

In above-illustrated embodiments, the fins may be patterned by anysuitable method. For example, the fins may be patterned using one ormore photolithography processes, including double-patterning ormulti-patterning processes. Generally, double-patterning ormulti-patterning processes combine photolithography and self-alignedprocesses, allowing patterns to be created that have, for example,pitches smaller than what is otherwise obtainable using a single, directphotolithography process. For example, in one embodiment, a sacrificiallayer is formed over a substrate and patterned using a photolithographyprocess. Spacers are formed alongside the patterned sacrificial layerusing a self-aligned process. The sacrificial layer is then removed, andthe remaining spacers, or mandrels, may then be used to pattern thefins.

Referring to FIG. 3, dummy gate stacks 30 are formed to extend on thetop surfaces and the sidewalls of (protruding) fins 24′. The respectiveprocess is illustrated as process 206 in the process flow 200 shown inFIG. 22. Dummy gate stacks 30 may include dummy gate dielectrics 32 anddummy gate electrodes 34 over the respective dummy gate dielectrics 32.Dummy gate electrodes 34 may be formed, for example, using polysilicon,and other materials may also be used. Each of dummy gate stacks 30 mayalso include one (or a plurality of) hard mask layer 36 over dummy gateelectrodes 34. Hard mask layers 36 may be formed of silicon nitride,silicon oxide, silicon oxynitride, or multi-layers thereof. Dummy gatestacks 30 may cross over a single one or a plurality of protruding fins24′ and/or STI regions 22. Dummy gate stacks 30 also have lengthwisedirections perpendicular to the lengthwise directions of protruding fins24′.

Next, gate spacers 38 are formed on the sidewalls of dummy gate stacks30. The respective process is also illustrated as process 206 in theprocess flow 200 shown in FIG. 22. In accordance with some embodimentsof the present disclosure, gate spacers 38 are formed of a dielectricmaterial(s) such as silicon nitride, silicon carbo-nitride, or the like,and may have a single-layer structure or a multi-layer structureincluding a plurality of dielectric layers.

An etching step is then performed to etch the portions of protrudingfins 24′ that are not covered by dummy gate stack 30 and gate spacers38, resulting in the structure shown in FIG. 4. The respective processis illustrated as process 208 in the process flow 200 shown in FIG. 22.The recessing may be anisotropic, and hence the portions of fins 24′directly underlying dummy gate stacks 30 and gate spacers 38 areprotected, and are not etched. The top surfaces of the recessedsemiconductor strips 24 may be lower than the top surfaces 22A of STIregions 22 in accordance with some embodiments. The spaces left by theetched protruding fins 24′ and semiconductor strips 24 are referred toas recesses 40. Recesses 40 are located on the opposite sides of dummygate stacks 30.

Next, as shown in FIG. 5, epitaxy regions (source/drain regions) 42 areformed by selectively growing (through epitaxy) a semiconductor materialin recesses 40. The respective process is illustrated as process 210 inthe process flow 200 shown in FIG. 22. Depending on whether theresulting FinFET is a p-type FinFET or an n-type FinFET, a p-type or ann-type impurity may be in-situ doped with the proceeding of the epitaxy.For example, when the resulting FinFET is a p-type FinFET, silicongermanium boron (SiGeB), silicon boron (SiB), or the like may be grown.Conversely, when the resulting FinFET is an n-type FinFET, siliconphosphorous (SiP), silicon carbon phosphorous (SiCP), or the like may begrown. In accordance with alternative embodiments of the presentdisclosure, epitaxy regions 42 comprise III-V compound semiconductorssuch as GaAs, InP, GaN, InGaAs, InAlAs, GaSb, AlSb, AlAs, AlP, GaP,combinations thereof, or multi-layers thereof. After Recesses 40 arefilled with epitaxy regions 42, the further epitaxial growth of epitaxyregions 42 causes epitaxy regions 42 to expand horizontally, and facetsmay be formed. The further growth of epitaxy regions 42 may also causeneighboring epitaxy regions 42 to merge with each other. Voids (airgaps) 44 may be generated. In accordance with some embodiments of thepresent disclosure, the formation of epitaxy regions 42 may be finishedwhen the top surface of epitaxy regions 42 is still wavy, or when thetop surface of the merged epitaxy regions 42 has become planar, which isachieved by further growing on the epitaxy regions 42 as shown in FIG.6.

After the epitaxy step, epitaxy regions 42 may be further implanted witha p-type or an n-type impurity to form source and drain regions, whichare also denoted using reference numeral 42. In accordance withalternative embodiments of the present disclosure, the implantation stepis skipped when epitaxy regions 42 are in-situ doped with the p-type orn-type impurity during the epitaxy.

FIG. 7 illustrates a perspective view of the structure after theformation of Contact Etch Stop Layer (CESL) 46 and Inter-LayerDielectric (ILD) 48. The respective process is illustrated as process212 in the process flow 200 shown in FIG. 22. CESL 46 may be formed ofsilicon oxide, silicon nitride, silicon carbo-nitride, or the like, andmay be formed using CVD, ALD, or the like. ILD 48 may include adielectric material formed using, for example, FCVD, spin-on coating,CVD, or another deposition method. ILD 48 may be formed of anoxygen-containing dielectric material, which may be a silicon-oxidebased dielectric material such as silicon oxide (formed using TetraEthyl Ortho Silicate (TEOS) as a process gas, for example),Phospho-Silicate Glass (PSG), Boro-Silicate Glass (BSG), Boron-DopedPhospho-Silicate Glass (BPSG), or the like. A planarization process suchas a Chemical Mechanical Polish (CMP) process or a mechanical grindingprocess may be performed to level the top surfaces of ILD 48, dummy gatestacks 30, and gate spacers 38 with each other.

Next, dummy gate stacks 30, which include hard mask layers 36, dummygate electrodes 34, and dummy gate dielectrics 32, are replaced withreplacement gate stacks 56, which include metal gate electrodes 54 andgate dielectrics 52 as shown in FIG. 8. The respective process isillustrated as process 214 in the process flow 200 shown in FIG. 22.When forming replacement gate stacks 56, hard mask layers 36, dummy gateelectrodes 34, and dummy gate dielectrics 32 as shown in FIG. 7 arefirst removed in one or a plurality of etching processes, resulting intrenches/openings to be formed between gate spacers 38. The top surfacesand the sidewalls of protruding semiconductor fins 24′ are exposed tothe resulting trenches.

Next, as shown in FIGS. 8A and 8B, which illustrate a perspective viewand a cross-sectional view, respectively, replacement gate dielectriclayers 52 are formed, which extend into the trenches between gatespacers 38. FIG. 8B illustrates the cross-section 8B-8B as shown in FIG.8A. The top surfaces 22A and bottom surfaces 22B of STI regions areillustrated in FIG. 8B to show the positions of the illustrated featuresrelative to the positions of STI regions. In accordance with someembodiments of the present disclosure, each of gate dielectric layers 52includes an Interfacial Layer (IL) as its lower part, which contacts theexposed surfaces of the corresponding protruding fins 24′. The IL mayinclude an oxide layer such as a silicon oxide layer, which is formedthrough the thermal oxidation of protruding fins 24′, a chemicaloxidation process, or a deposition process. Gate dielectric layer 52 mayalso include a high-k dielectric layer formed over the IL. The high-kdielectric layer may include a high-k dielectric material such ashafnium oxide, lanthanum oxide, aluminum oxide, zirconium oxide, siliconnitride, or the like. The dielectric constant (k-value) of the high-kdielectric material is higher than 3.9, and may be higher than about7.0. The high-k dielectric layer is formed as a conformal layer, andextends on the sidewalls of protruding fins 24′ and the sidewalls ofgate spacers 38. In accordance with some embodiments of the presentdisclosure, the high-k dielectric layer is formed using ALD or CVD.

Referring further to FIGS. 8A and 8B, gate electrodes 54 are formed overgate dielectrics 52. Gate electrodes 54 include stacked conductivelayers. The stacked conductive layers are not shown separately, whilethe stacked conductive layers may be distinguishable from each other.The deposition of the stacked conductive layers may be performed using aconformal deposition method(s) such as ALD or CVD. The stackedconductive layers may include a diffusion barrier layer and one (ormore) work-function layer over the diffusion barrier layer. Thediffusion barrier layer may be formed of titanium nitride (TiN), whichmay (or may not) be doped with silicon. The work-function layerdetermines the work function of the gate, and includes at least onelayer, or a plurality of layers formed of different materials. Thematerial of the work-function layer is selected according to whether therespective FinFET is an n-type FinFET or a p-type FinFET. For example,when the FinFET is an n-type FinFET, the work-function layer may includea TaN layer and a titanium aluminum (TiAl) layer over the TaN layer.When the FinFET is a p-type FinFET, the work-function layer may includea TaN layer and a TiN layer over the TaN layer. After the deposition ofthe work-function layer(s), a barrier (glue) layer, which may be anotherTiN layer, is formed. The barrier layer may or may not fully fill thetrenches left by the removed dummy gate stacks.

The deposited gate dielectric layers and conductive layers are formed asconformal layers extending into the trenches, and include some portionsover ILD 48. Next, if the barrier layer does not fully fill thetrenches, a metallic material is deposited to fill the remainingtrenches. The metallic material may be formed of tungsten or cobalt, forexample. Subsequently, a planarization process such as a CMP process ora mechanical grinding process is performed, so that the portions of thegate dielectric layers, stacked conductive layers, and the metallicmaterial over ILD 48 are removed. As a result, gate electrodes 54 andgate dielectrics 52 are formed. Gate electrodes 54 and gate dielectrics52 are collectively referred to as replacement gate stacks 56. The topsurfaces of replacement gate stacks 56, gate spacers 38, CESL 46, andILD 48 may be substantially coplanar at this time.

FIGS. 8A and 8B also illustrate the formation of (self-aligned) hardmasks 58 in accordance with some embodiments. The respective process isillustrated as process 216 in the process flow 200 shown in FIG. 22. Theformation of hard masks 58 may include performing an etching process torecess gate stacks 56, so that recesses are formed between gate spacers38, filling the recesses with a dielectric material, and then performinga planarization process such as a CMP process or a mechanical grindingprocess to remove excess portions of the dielectric material. Hard masks58 may be formed of silicon nitride, silicon oxynitride, siliconoxy-carbo-nitride, or the like.

FIGS. 9A and 9B illustrate a perspective view and a cross-sectionalview, respectively, in the formation of source/drain contact openings60. The respective process is illustrated as process 218 in the processflow 200 shown in FIG. 22. The formation of contact openings 60 includeetching ILD 48 to expose the underlying portions of CESL 46, and thenetching the exposed portions of CESL 46 to reveal epitaxy regions 42. Inaccordance with some embodiments of the present disclosure, asillustrated in FIG. 9A, gate spacers 38 are spaced apart from thenearest contact openings 60 by some remaining portions of ILD 48. Inaccordance with other embodiments, the sidewalls of gate spacers or CESL46 are exposed to contact openings 60.

Referring to FIGS. 10A and 10B, silicide regions 66 and source/draincontact plugs 70 are formed. In accordance with some embodiments, metallayer 62 (such as a titanium layer or a cobalt layer, FIG. 10B) isdeposited, for example, using Physical Vapor Deposition (PVD) or a likemethod. Metal layer 62 is a conformal layer, and extends onto the topsurface of source/drain regions 42 and the sidewalls of ILD 48 and CESL46. A metal nitride layer (such as a titanium nitride layer) 64 is thendeposited as a capping layer. An annealing process is then performed toform source/drain silicide regions 66, as shown in FIGS. 10A and 10B.The respective process is illustrated as process 220 in the process flow200 shown in FIG. 22. Next, a metallic material 68 such as cobalt,tungsten, or the like, is filled into the remaining portions of thecontact openings. A planarization process such as a CMP process or amechanical grinding process is then performed to remove excess portionsof metal layer 62 and the metallic material, leaving contact plugs 70.The respective process is also illustrated as process 220 in the processflow 200 shown in FIG. 22.

Referring to FIG. 11, etch stop layer 72 is deposited. The respectiveprocess is illustrated as process 222 in the process flow 200 shown inFIG. 22. Etch stop layer 72 may be formed of a silicon-containingmaterial such as SiN, SiCN, SiC, SiOCN, or the like. The formationmethod may include PECVD, ALD, CVD, or the like.

Next, referring to FIG. 12A, an implantation process 74 is performed.The respective process is illustrated as process 224 in the process flow200 shown in FIG. 22. In the implantation process, a dopant that maymodify the etching characteristic of metal region 68, as will bediscussed in detail subsequently, is implanted. In accordance with someembodiments, the dopant comprises Ge, Xe, Ar, Si, or combinationsthereof. The energy of the implantation is selected to be in a range,which is not too high and not too low. If the implantation energy is toohigh, the dopant may penetrate through etch stop layer 72, ILD 48 andCESL 46 and reach source/drain regions 42. This may adversely change theproperty of the resulting FinFET in an un-controllable way. Furthermore,the dopant may extend into the metal region 68 too deep. This will causethe resulting recess 82 (FIG. 15) to be too deep, defeating the purposeof the implantation. If the implantation energy is too low, the dopantcannot extend into metal region 68 enough, again making the lateralexpansion of the recess 82 (FIG. 16) to be difficult since it isdifficult to laterally expand recess 82 when it is too shallow. Inaccordance with some embodiments, the implantation may be performed withan energy in the range between about 2 keV and about 50 keV. The dosageof the dopant is also selected so that it is not too high to change thecharacteristic of the etch stop layer, implanted ILD 48, CESL 46 toomuch, and not too low so that the etching characteristic of implantedportions of metal region 68 is not adequately modified. In accordancewith some embodiments, the dosage is in the range between about 1E14/cm²and 1E16/cm². The implantation may be performed vertically, or tiltedwith a tilt angle smaller than about 60 degrees. During theimplantation, the wafer 10 may be cooled or heated, or may be at theroom temperature. For example, the temperature may be in the rangebetween about −100° C. and about 500° C. during the implantation.

In FIGS. 12A and 12B, etch stop layer 72 are drawn as being dashed toindicate that etch stop layer 72 may be formed before or after theimplantation process 74. Accordingly, when the implantation process 74is performed, etch stop layer 72 may or may not be formed.

Referring to FIGS. 12A, as a result of the implantation, doped regions76A are formed in metal region 68, and doped regions 76B are formed indielectric layers such as ILD 48, gate spacers 38, and hard masks 58.Throughout the description, doped regions 76A and 76B are collectivelyreferred to as doped regions 76. The top surfaces of doped regions 76Bare drawn as being lower than the top surfaces of doped regions 76A toshow that the dopant is more likely to pile up at the top surfaces ofmetal regions 68. It is appreciated that the subsequent processes mayinclude annealing processes, which causes the doped regions 76A and 76Bto diffuse outwardly. Accordingly, the positions and the depths of dopedregions 76A and 76B may change before/after anneal due to the diffusionof the implanted species. The doped regions 76A and 76B, however,actually may extend through the entire thickness of etch stop layer 72.The illustrated doped regions 76A and 76B may thus represent the regionswith relatively high concentrations, for example, with concentrationssmaller than the respective peak concentration values by differencesthat are smaller than two orders (or may be three orders). The dopantpenetrates through etch stop layer 72. It is appreciated that which ofthe portions of doped region 76B in gate spacers 38 and the portions inthe hard masks 58 extend deeper depends on the comparison of the densityvalues of gate spacers 38 and the hard masks 58, and doped regionsextend shallower in denser materials. Accordingly, the portions of dopedregion 76B in gate spacers 38 have similar depths as that in the hardmasks 58. Furthermore, the bottoms of the portions of doped region 76Bin gate spacers 38 may be higher than, level with, or lower than, thebottoms of the portions of doped region 76B in hard masks 58. In FIGS.12A and 12B, the possible top surfaces of doped 76A and 76B areillustrated. The top surfaces 76BT and 76AT that are level with the topsurface of etch stop layer 72 represent the embodiments in which dopedregions 76A and 76B extend to the top surface of etch stop layer. Also,as shown in FIGS. 18 and 19, near the boundary between metal region 68and the overlying etch stop layer 72, there is a sudden change in dopingconcentration, while there is a less sudden change in dopingconcentration between ILD 48 and the overlying etch stop layer 72. Alsoreferring to FIGS. 12A and 12B, there is a sudden change inconcentration at the boundary between doped regions 76A and theirneighboring doped regions 76B.

Since the metal region 68 is denser, and the dielectric layers arerelatively sparse, the depth D1 of the doped regions 76A is smaller thanthe depth D2 of the doped regions 76B in the dielectric layers. Inaccordance with some embodiments, the depth D1 is smaller than the totalthickness T1 of contact plug 70. Also, the depth D2 is smaller than thetotal thickness T2 of CESL 46 and ILD 48. For example, ratio D1/T1 maybe in the range between about 0.05 and about 0.2. Ratio D2/T2 may be inthe range between about 0.1 and about 1. Also, ratio D1/D2 may be in therange between about 0.05 and about 0.5. In accordance with someembodiments, depth D1 is in the range between about 1 nm and about 10nm, and depth D2 is in the range between about 5 nm and about 20 nm.

In accordance with some embodiments, as shown in FIG. 12A, theimplantation is performed on wafer 10 without any implantation mask, sothat an entirety of wafer 10 is subject to the implantation, and allsurface features of the wafer 10 receive the dopant. In accordance withalternative embodiments, as shown in FIG. 12B, the implantation isperformed with implantation mask 75 being formed to mask the regions notto be implanted. For example, assuming the material of the gateelectrode 54 is not prone to the loss or corrosion due to the slurryused in subsequent planarization process, implantation mask 75 may coverthe gate electrode 54 and the overlying hard masks 58, and may covergate spacers 38. Furthermore, implantation mask 75 may covernon-transistor regions. FIG. 20 schematically illustrates an implantedregion 76A and surrounding implanted regions 76B relative to theunderlying contact plug 70 when a mask is adopted.

Since metal region 68 is dense, the dopant is piled up around (bothhigher than and lower than) the top surface of metal region 68. Also,the dopant may have some portions directly over metal region 68 andextend into at least the lower portions of etch stop layer 72. Thiscauses doped regions 76A to extend into at least the lower portion, andpossibly extend into the entirety, of etch stop layer 72. FIG. 18illustrates a distribution profile of the dopant in metal region 68 andetch stop layer 72 in accordance with some embodiments. The distributionprofile is measured on a sample wafer using Secondary-Ion MassSpectrometry (SIMS). The X-axis shows the depth measured from the topsurface of etch stop layer 72 and in the direction marked by arrow 77Ain FIG. 12A. The Y-axis shows the normalized dopant concentration. It isobserved that the peak dopant concentration of doped region is at theinterface between etch stop layer 72 and metal region 68, indicating thepile-up of the dopant at the interface. Also, there is a highconcentration of the dopant in etch stop layer 72, which may be causedby the back-scattering from metal region 68. Accordingly, as shown inFIG. 12, doped region 76A is illustrated as extending into etch stoplayer 72. In accordance with some embodiments, the dopant concentrationin metal region 68 and etch stop layer 72 may be in the range betweenabout 1E17/cm³ and about 1E22/cm³. The peak dopant concentration inmetal region 68 and etch stop layer 72 may be in the range between about1E20/cm³ and about 1E22/cm³.

FIG. 19 illustrates a distribution profile of the dopant in ILD 48 andetch stop layer 72 in accordance with some embodiments. The distributionprofile is also measured from the sample wafer using SIMS. The X-axisshows the depth measured from the top surface of etch stop layer 72 andin the direction marked by arrow 77B in FIG. 12A. The Y-axis shows thenormalized dopant concentration. Since dielectric layers are relativelyloose, the peak concentration of the doped regions 76B is inside ILD 48,rather than at the interface between etch stop layer 72 and ILD 48. Thedopant in ILD 48 extends deeper than doped region 76A, but has lesssteep change. In accordance with some embodiments, the dopantconcentration in etch stop layer and ILD 48 may be in the range betweenabout 1E17/cm³ and about 1E22/cm³. The peak dopant concentration in etchstop layer 72 and ILD 48 may be in the range between about 1E17/cm³ andabout 1E22/cm³.

In accordance with some embodiments, the bottom parts of metal regions68 have a dopant concentration (of the implanted dopant) that is atleast three orders (1,000 times) lower than the peak dopantconcentration at the interface between metal region 68 and etch stoplayer 72. The bottom parts of metal regions 68 may be free from theimplanted dopant in accordance with some embodiments. In accordance withsome embodiments, the bottom parts of metal ILD 48 and the underlyingpart of CESL 46 have a dopant concentration (of the implanted dopant)that is at least three orders (1,000 times) or four orders lower thanthe peak dopant concentration in ILD 48. The bottom parts of ILD 48 maybe free from the implanted dopant in accordance with some embodiments.

Referring to FIG. 13, ILD 78 is formed over etch stop layer 72. Therespective process is illustrated as process 226 in the process flow 200shown in FIG. 22. The material and the formation method of ILD 78 may beselected from the same candidate materials and formation methods forforming ILD 48. For example, ILD 78 may include silicon oxide, PSG, BSG,BPSG, or the like, which includes silicon therein. In accordance withsome embodiments, ILD 78 is formed using PECVD, FCVD, spin-on coating,or the like.

FIG. 14 illustrates the etching of ILD 78 to form source/drain contactopenings 80. The respective process is illustrated as process 228 in theprocess flow 200 shown in FIG. 22. In accordance with some embodiments,ILD 78 is etched using a process gas including C₂F₆, CF₄, SO₂, themixture of HBr, Cl₂, and O₂, or the mixture of HBr, Cl₂, O₂, and CF₂etc.. The etching processes are anisotropic.

Next, as also shown in FIG. 14, etch stop layer 72 is etched in ananisotropic process. The respective process is also illustrated asprocess 228 in the process flow 200 shown in FIG. 22. Source/draincontact plugs 70 are thus exposed to source/drain openings 80. Etch stoplayer 72 may be etched using a fluorine-containing gas such as themixture of CF₄, O₂, and N₂, the mixture of NF₃ and O₂, SF₆, or, themixture of SF₆ and O₂. The etching may be anisotropic or isotropic.Accordingly, the portions of openings 80 in etch stop layer 72 may be,or may not be, wider than the portions of openings 80 in ILD 78.

Referring to FIG. 15, an isotropic etching process is performed using anetchant attacking metal region 68. The respective process is illustratedas process 230 in the process flow 200 shown in FIG. 22. Accordingly,recess (opening) 82 is formed in metal region 68. The recess 82 includesthree portions: a bigger upward-facing bowl recess, a smallerdownward-facing bowl recess over the bigger upward-facing bowl recess,and a through-hole over the smaller downward bowl recess. The biggerupward-facing bowl recess has a curved bottom surface. The smallerdownward-facing bowl recess has a curved top surface. The through-holehas substantially straight edges. The etching may include a dry etchingprocess or a wet etching process. Also, the etching chemical is selectednot to etch ILD 78 and etch stop layer 72 (except that thedopant-containing portions of etch stop layer 72 may be etched). Theetching chemical is also selected in response to the dopant used forforming doped regions 76A, so that the doped regions 76A in metal region68 have a higher etching rate than the un-doped portions of metal region68. For example, when a dry etching process is used, the etching gas mayinclude O₂, Ar, C₄F₆, or the like. When a wet etching process is used,the etching solution may include de-ionized (DI) water, benzotriazole(BTA), HF, or the like. The ratio of the etching rate of doped regions76A to the etching rate of the undoped (or less doped) bottom portionsof metal regions 68 is greater than 1.0, and may be in the range betweenabout 1 and about 5.

Since the doped regions 76A have a higher etching rate than theunderlying undoped (or less doped) portions of metal regions 68, theetching is initially fast in the surface portions of metal regions 68where the dopant concentrate is high. When the recess extends into lowerportions of metal region 68 wherein the dopant concentration is reduced,the downward etching rate starts to reduce. On the other hand, thelateral etching rate does not reduce since with the proceeding of thelateral etching, the newly etched portions have the same dopantconcentrate as the previously etched portions. In accordance with someembodiments, the lateral extending distance L1 of recess 82 may be inthe range between about 1 nm and about 15 nm, and the depth D3 of recess82 may be in the range between about 1 nm and about 20 nm. The ratioL1/D3 is greater than 0.5, and may be greater than about 1. The ratioL1/D3 may also be in the range between about 0.5 and about 1.5.

Further referring to FIG. 15, since the dopant may be back-scatteredback from metal region 68 into etch stop layer 72 and pile up in atleast the bottom portion of etch stop layer 72, the portions of etchstop layer 72 directly over metal region 68 may be etched in theisotropic etching process, and opening 80 laterally extends into etchstop layer 72 to form opening portions 80′. In accordance with someembodiments, opening portions 80′ are in the bottom portion of etch stoplayer 72, while the top portion of etch stop layer 72 is not laterallyrecessed in the isotropic etch, as shown in FIG. 15. In accordance withalternative embodiments, opening portions 80′ also extend into the topportion of etch stop layer 72. In accordance with some embodiments, thelateral extending distance L2 of opening portions 80′ may be in therange between about 0.5 nm and about 3 nm. Since the etchant is selectedto specifically etch metal regions 76A, not for laterally extending etchstop layer 72, the ratio L2/L1 is smaller than 1.0, and may be in therange between about 0.05 and about 0.5.

In accordance with yet other embodiments, for example, when etch stoplayer 72 is formed after the implantation process 74 (FIGS. 12A and12B), etch stop layer 72 has little or no dopant therein, and openingportions 80′ are not formed.

FIG. 15 also illustrates the formation of gate contact opening 84 inaccordance with some embodiments, which is formed by etching ILD 78,etch stop layer 72, and hard mask 58. The respective process isillustrated as process 232 in the process flow 200 shown in FIG. 22. Inthe following discussed example embodiments as shown in FIGS. 16 and 17,gate contact plug 87 and source/drain contact plugs 86 are formedsharing a common metal filling process. It is appreciated that gatecontact plug 87 may also be formed before or after the formation ofsource/drain contact plugs 86. The process 232 as shown in the processflow shown in FIG. 21 is thus drawn as a dashed box to indicate it mayor may not be performed at this time.

FIG. 16 illustrates the deposition of metallic material 85, which may bedeposited using PVD, CVD, plating, combinations thereof, or the like.The respective process is illustrated as process 234 in the process flow200 shown in FIG. 22. Metallic material 85 may include tungsten, cobalt,molybdenum, copper, or alloys thereof. Furthermore, the metallicmaterial 85 may be different from the material of metal region 68. Forexample, when metal region 68 is formed of or comprises cobalt, metallicmaterial 85 may be formed of or comprises tungsten. The entireties ofmetallic material 85 may be homogenous (and no glue layer is formed).Metallic material 85 may be filled to have top surfaces slightly higherthan or lower than the top surface of ILD 78.

In a subsequent process, a planarization process such as a CMP processor a mechanical grinding process is performed to remove excess portionsof metallic material 85, hence forming gate contact plug 87 andsource/drain contact plugs 86. The respective process is illustrated asprocess 236 in the process flow 200 shown in FIG. 22. The resultingstructure is shown in FIG. 17. In accordance with some embodiments, theCMP is performed using an acidic slurry. In accordance with ottherembodiments, the CMP is performed using an alkaline slurry. Inaccordance with some embodiments, the selected slurry does not corrodegate contact plug 87 and source/drain contact plugs 86, but may corrodecontact plugs 70.

A contact plug 86 includes top portion 86A in ILD 78, with portion 86Ahaving substantially straight edges. The bottom portion 86C is in metalregion 68, and includes portion 86C1, which is directly underlyingcontact plug portion 86A, and portions 86C2, which are on opposing sidesof portion 86A, and are directly underlying ILD 78. When viewed from thetop of contact plug 86, portions 86C2 form a full ring encirclingportion 86C1 (as shown in FIG. 20). Also, contact plug 86 includesportion 86B in etch stop layer 72, and the contact plug portion 86B alsoincludes portion 86B1, which is directly underlying contact plug portion86A, and portions 86B2, which are on opposing sides of portion 86B2, andare directly underlying ILD 78. When viewed from the top of contact plug86, portions 86B2 form a full ring encircling portion 86C1 (as shown inFIG. 20). The sizes of contact plug portions 86A, 86B, and 86C are thesame as the corresponding opening 80 and recess 82 (FIG. 15), and hencethen shapes and dimensions are not repeated herein.

In accordance with yet other embodiments, for example, when etch stoplayer 72 is formed after the implantation process 74 (FIGS. 12A and12B), etch stop layer 72 has little or no dopant therein, and portions86B2 are not formed.

Gate contact plug 87 and source/drain contact plug 86 areglue-layer-less contact plugs, with no glue layers formed to adhere themetallic material 85 (FIG. 16) to ILD 78. Accordingly, due to theinferior adhesion of contact plugs 87/86 to ILD 78 and etch stop layer72, there may be seams (not shown) separating contact plugs 87/86 andILD 78 from etch stop layer 72. The slurry used in the planarization ofmetallic material 85 may pass through the seams. If there are noexpanded portions 86C, or the expanded portions 86C are not big enough,the slurry 88 may reach metal region 68. In accordance with someembodiments, metal region 68 is formed of a material (such as cobalt)different from the material (such as tungsten) of contact plugs 87 and86. Contact plugs 87 and 86 may not suffer from the corrosion of theslurry (which may be acidic, while metal region 68 may suffer from thecorrosion from slurry 88 in accordance with some embodiments. With theenlarged contact extension portions 86C, the slurry is blocked fromreaching metal region 68, and the corrosion is at least reduced, andpossibly eliminated.

FIG. 21 illustrates the lateral recessing distance (for example, L1 inFIG. 15) as a function of recessing depth (for example, D3 in FIG. 15).Dot 90 is an experiment result obtained by forming openings 80 and 82(FIG. 15) without the implanting process for doping the dopant. Dot 92is an experiment result obtained by forming openings 80 and 82 with theimplanting process performed by implanting germanium. The resultsindicate that when the recessing depth is 10 nm, the lateral recessingdistance is increased by about 50 percent when the embodiments of thepresent disclosure are adopted. Lines 94 and 96 are expected plot of thelateral recessing distance as a function of the recessing depth.

The embodiments of the present disclosure have some advantageousfeatures. By implanting a top portion of a lower-level contact plug, theetching selectivity between the top portion and a respective lowerportion of the lower-level contact plug is increased. In the recessingof the lower-level contact plug for forming an upper-level contact plug,lateral recessing is increased without increasing vertical recessing.The bottom portion of the resulting upper-level contact plug is thuslaterally expanded, and has improved ability for blocking slurry, whichmay cause the corrosion of the lower-level contact plug.

In accordance with some embodiments of the present disclosure, a methodincludes forming a metallic feature; forming an etch stop layer over themetallic feature; implanting the metallic feature with a dopant; forminga dielectric layer over the etch stop layer; performing a first etchingprocess to etch the dielectric layer and the etch stop layer to form afirst opening; performing a second etching process to etch the metallicfeature and to form a second opening in the metallic feature, whereinthe second opening is joined with the first opening; and filling thefirst opening and the second opening with a metallic material to form acontact plug. In an embodiment, in the implanting, an element selectedfrom the group consisting of Ge, Xe, Ar, Si, and combinations thereof isimplanted. In an embodiment, in the implanting, germanium is implanted.In an embodiment, in the implanting the metallic feature, a top portionof the metallic feature is implanted, and a bottom portion of themetallic feature is not implanted. In an embodiment, the metallicfeature is formed in an additional dielectric layer, and wherein a topportion of the additional dielectric layer is implanted, and a bottomportion of the additional dielectric layer is not implanted. In anembodiment, the implanting is performed after the etch stop layer isperformed, with the dopant penetrating through the etch stop layer. Inan embodiment, the implanting is performed before the etch stop layer isformed. In an embodiment, the first etching process comprises ananisotropic etching process. In an embodiment, the second etchingprocess comprises an isotropic etching process.

In accordance with some embodiments of the present disclosure, astructure includes a first dielectric layer; a metallic feature in thefirst dielectric layer, wherein an upper portion of the metallic featurecomprises a dopant having a first dopant concentration, and a lowerportion of the metallic feature has a second dopant concentration of thedopant smaller than the first dopant concentration; a second dielectriclayer over the metallic feature; and a contact plug comprising a firstportion penetrating through the second dielectric layer; and a secondportion in the metallic feature, wherein the second portion laterallyextends beyond edges of the first portion, and the second portion has abottom in the upper portion of the metallic feature. In an embodiment,the dopant comprises germanium. In an embodiment, the lower portion issubstantially free from the dopant. In an embodiment, the method furtherincludes an etch stop layer between the metallic feature and the seconddielectric layer, and the contact plug further comprises a third portionin the etch stop layer. In an embodiment, the third portion of thecontact plug comprises a first sub portion directly underlying andoverlapped by the first portion of the contact plug; and a second subportion forming a ring encircling the first sub portion, wherein thesecond portion extends laterally beyond edges of the first portion ofthe contact plug. In an embodiment, the second sub portion has a heightsmaller than a thickness of the etch stop layer. In an embodiment, theetch stop layer further comprises the dopant. In an embodiment, themetallic feature comprises cobalt, and the contact plug comprisestungsten, with the tungsten in physical contact with the metallicfeature, and the second dielectric layer.

In accordance with some embodiments of the present disclosure, astructure includes a source/drain region; a silicide region over andcontacting the source/drain region; a first inter-layer dielectric; afirst contact plug over and contacting the silicide region, with thefirst contact plug being in the first inter-layer dielectric; an etchstop layer over and contacting the first contact plug; a secondinter-layer dielectric over and contacting the etch stop layer; and asecond contact plug comprising a first portion in the second inter-layerdielectric; a second portion in the etch stop layer, wherein at least alower part of the second portion extends laterally beyond edges of thefirst portion; and a third portion extending into the first contactplug, wherein the third portion extends laterally beyond edges of thesecond portion. In an embodiment, the etch stop layer and an upper partof the first contact plug comprises a dopant, with both of the thirdportion and the at least the lower part of the second portion being inthe dopant. In an embodiment, an upper part of the second portion of thesecond contact plug comprises edges that are flush with the edges of thefirst portion.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: forming a metallic feature;forming an etch stop layer over the metallic feature; implanting themetallic feature with a dopant; forming a dielectric layer over the etchstop layer; performing a first etching process to etch the dielectriclayer and the etch stop layer to form a first opening; performing asecond etching process to etch the metallic feature and to form a secondopening in the metallic feature, wherein the second opening is joinedwith the first opening; and filling the first opening and the secondopening with a metallic material to form a contact plug.
 2. The methodof claim 1, wherein in the implanting, an element selected from thegroup consisting of Ge, Xe, Ar, Si, and combinations thereof isimplanted.
 3. The method of claim 2, wherein in the implanting,germanium is implanted.
 4. The method of claim 1, wherein in theimplanting the metallic feature, a top portion of the metallic featureis implanted, and a bottom portion of the metallic feature is notimplanted.
 5. The method of claim 1, wherein the metallic feature isformed in an additional dielectric layer, and wherein a top portion ofthe additional dielectric layer is implanted, and a bottom portion ofthe additional dielectric layer is not implanted.
 6. The method of claim1, wherein the implanting is performed after the etch stop layer isperformed, with the dopant penetrating through the etch stop layer. 7.The method of claim 1, wherein the implanting is performed before theetch stop layer is formed.
 8. A structure comprising: a first dielectriclayer; a metallic feature in the first dielectric layer, wherein anupper portion of the metallic feature comprises a dopant having a firstdopant concentration, and a lower portion of the metallic feature has asecond dopant concentration of the dopant smaller than the first dopantconcentration; a second dielectric layer over the metallic feature; anda contact plug comprising: a first portion penetrating through thesecond dielectric layer; and a second portion in the metallic feature,wherein the second portion laterally extends beyond edges of the firstportion, and the second portion has a bottom in the upper portion of themetallic feature.
 9. The structure of claim 8, wherein the dopantcomprises germanium.
 10. The structure of claim 8, wherein the lowerportion is substantially free from the dopant.
 11. The structure ofclaim 8 further comprising an etch stop layer between the metallicfeature and the second dielectric layer, and the contact plug furthercomprises a third portion in the etch stop layer.
 12. The structure ofclaim 11, wherein the third portion of the contact plug comprises: afirst sub portion directly underlying and overlapped by the firstportion of the contact plug; and a second sub portion forming a ringencircling the first sub portion, wherein the second portion extendslaterally beyond edges of the first portion of the contact plug.
 13. Thestructure of claim 12, wherein the second sub portion has a heightsmaller than a thickness of the etch stop layer.
 14. The structure ofclaim 11, wherein the third portion comprises a portion having a roundedtop surface.
 15. The structure of claim 11, wherein the etch stop layerfurther comprises the dopant.
 16. The structure of claim 8, wherein thesecond portion comprises a rounded bottom surface extending from topsurface of the metallic feature into the metallic feature.
 17. Thestructure of claim 8, wherein the metallic feature comprises cobalt, andthe contact plug comprises tungsten, with the tungsten in physicalcontact with the metallic feature, and the second dielectric layer. 18.A structure comprising: a source/drain region; a silicide region overand contacting the source/drain region; a first inter-layer dielectric;a first contact plug over and contacting the silicide region, with thefirst contact plug being in the first inter-layer dielectric; an etchstop layer over and contacting the first contact plug; a secondinter-layer dielectric over and contacting the etch stop layer; and asecond contact plug comprising: a first portion in the secondinter-layer dielectric; a second portion in the etch stop layer, whereinat least a lower part of the second portion extends laterally beyondedges of the first portion; and a third portion extending into the firstcontact plug, wherein the third portion extends laterally beyond edgesof the second portion.
 19. The structure of claim 18, wherein the etchstop layer and an upper part of the first contact plug comprises adopant, with both of the third portion and the at least the lower partof the second portion being in the dopant.
 20. The structure of claim18, wherein an upper part of the second portion of the second contactplug comprises edges that are flushed with the edges of the firstportion.